Preferred Substrates: Duplex Boards, Paper, PP, PVC, Sticker, Offset Blanket
Sizes Available (mm): 900 * 600,1200 * 900,1500 * 900,1500 * 1200,1800 * 1200
The DCH30 series cutting machine is designed with the function of laser positioning, making the product particularly suitable for cutting the printed substrate. Accurate positioning is realized through perfect matching between the laser and the preprinted mark on the printed material.
Features
A) Cuts upto 2 mm Non-Hard Substrates
B) Dual Head Configuration – Cut & Crease
C) Cutting, Half Cut, Creasing, Drawing Tools
D) Vacuum enabled table for Stable Sampling